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| CATALOG |
| 10CL025YU256C8G COUNTRY OF ORIGIN |
10CL025YU256C8G PARAMETRIC INFO
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10CL025YU256C8G PACKAGE INFO
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10CL025YU256C8G MANUFACTURING INFO
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10CL025YU256C8G PACKAGING INFO
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COUNTRY OF ORIGIN
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| Malaysia |
Indonesia
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Korea (Republic of)
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Taiwan (Province of China)
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Thailand
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PARAMETRIC INFO
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| Device Logic Units |
24624 |
| Device Logic Cells |
24624 |
| Maximum Number of User I/Os |
150 |
| Device Number of DLLs/PLLs |
4 |
| Number of Multipliers |
66 (18x18) |
| Tradename |
Cyclone |
| RAM Bits (Kbit) |
594 |
| Total Number of Block RAM |
66 |
| Program Memory Type |
SRAM |
| Family Name |
Cyclone® 10 LP |
| Speed Grade |
8 |
| Copy Protection |
No |
| Programmability |
Yes |
| In-System Programmability |
No |
| Reprogrammability Support |
No |
| I/O Voltage (V) |
1.2|1.5|1.8|2.5|3|3.3 |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Jun |
| Supplier Temperature Grade |
Commercial |
| Digital Control Impedance |
No |
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PACKAGE INFO
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| Supplier Package |
UFBGA |
| Pin Count |
256 |
| Lead Shape |
Ball |
| PCB |
256 |
| Tab |
N/R |
| Package Length (mm) |
14 |
| Package Width (mm) |
14 |
| Package Height (mm) |
0.95 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Ultra Fine Pitch Ball Grid Array |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
119 |
| Packaging Document |
Link to Datasheet |
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