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• 1-to-8 Bidirectional translating switches |
• I
2C Bus and SMBus compatible |
• Active-low reset input |
• Three address pins, allowing up to eight
TCA9548A devices on the I
2C bus
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• Channel selection through an I
2C Bus, in any
combination
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• Power up with all switch channels deselected |
• Low RON switches |
• Allows voltage-level translation between 1.8-V,
2.5-V, 3.3-V, and 5-V buses |
• No glitch on power up |
• Supports hot insertion |
• Low standby current |
• Operating power-supply voltage range of
1.65 V to 5.5 V |
• 5-V Tolerant inputs
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• 0- to 400-kHz Clock frequency |
• Latch-up performance exceeds 100 mA Per JESD
78, class II |
• ESD Protection exceeds JESD 22
– ±2000-V Human-body model (A114-A)
– 200-V Machine model (A115-A)
– ±1000-V Charged-device model (C101)
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CATALOG |
TCA9548ARGER COUNTRY OF ORIGIN |
TCA9548ARGER PARAMETRIC INFO |
TCA9548ARGER PACKAGE INFO |
TCA9548ARGER MANUFACTURING INFO |
TCA9548ARGER PACKAGING INFO |
TCA9548ARGER ECAD MODELS |
TCA9548ARGER FUNCTIONAL BLOCK DIAGRAM |
TCA9548ARGER APPLICATIONS |
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COUNTRY OF ORIGIN |
Japan |
Malaysia |
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PARAMETRIC INFO |
Logic Function |
I2C Bus Switch |
Number of Elements per Chip |
1 |
Number of Inputs per Chip |
8 |
Number of Outputs per Chip |
8 |
Configuration |
8 x 1:1 |
Maximum Supply Current (mA) |
100 |
Maximum On Resistance (Ohm) |
25(Typ) |
Minimum Operating Supply Voltage (V) |
1.65 |
Maximum Operating Supply Voltage (V) |
5.5 |
Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Maximum Propagation Delay Time @ Maximum CL (ns) |
1@1.65V to 5.5V |
Absolute Propagation Delay Time (ns) |
1 |
Propagation Delay Test Condition (pF) |
50 |
Maximum Low Level Output Current (mA) |
9(Typ) |
Maximum Quiescent Current (uA) |
80 |
Typical Quiescent Current (uA) |
50 |
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PACKAGE INFO |
Supplier Package |
VQFN EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
24 |
Lead Shape |
No Lead |
PCB |
24 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
4.15(Max) |
Package Width (mm) |
4.15(Max) |
Package Height (mm) |
0.95(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
4.15(Max) |
Package Overall Width (mm) |
4.15(Max) |
Package Overall Height (mm) |
1(Max) |
Seated Plane Height (mm) |
1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
Package Family Name |
QFN |
Jedec |
MO-220 |
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MANUFACTURING INFO |
MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO |
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
12.4 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q2 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS |
• Servers |
• Routers (telecom switching equipment) |
• Factory Automation |
• Products with I
2C slave address conflicts (such as
multiple, identical temperature sensors)
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